SI5938DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual N-Channel 20-V (D-S) MOSFET

Dual N-Channel 20-V (D-S) MOSFET
Si5938DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.039 at V_GS = 4.5 V
20
0.045 at V_GS = 2.5 V
0.055 at V_GS = 1.8 V
PowerPAK ChipFET Dual
1
S₁
2
D1
8
D1
7
6
G1
D₂
D₂
5
3
S2
4
G₂
I_D (A)^a
6
6
6
Q_g (Typ.)
6 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
Marking Code
CA XXX
Lot Traceability
and Date Code
Part # Code
APPLICATIONS
• Load Switch for Portable Applications
• DC-DC Point-of-Load _D1
G₁
G₂
RoHS
COMPLIANT
D₂
Bottom View
Ordering Information: Si5938DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V
V_GS
±8
T_C = 25 °C
6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6^a
7.2^{b, c}
T_A = 70 °C
5.8^{b, c}
A
Pulsed Drain Current
I_DM
20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6.9
1.9^{b, c}
T_C = 25 °C
8.3
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5.3
2.3^{b, c}
W
T_A = 70 °C
1.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
45
Steady State
R_thJC
12
55
°C/W
15
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 73463
S-81449-Rev. B, 23-Jun-08
www.vishay.com
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