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SI5904DC Datasheet, PDF (1/4 Pages) Vishay Siliconix – Dual N-Channel 2.5-V (G-S) MOSFET | |||
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Si5904DC
Vishay Siliconix
Dual N-Channel 2.5-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V)
20
rDS(on) (â¦)
0.075 @ VGS = 4.5 V
0.134 @ VGS = 2.5 V
1206-8 ChipFETt
1
S1
D1
G1
D1
S2
D2
G2
D2
Bottom View
Ordering Information: Si5904DC-T1
ID (A)
ï§4.2
ï§3.1
D1
D2
Marking Code
CB XX
Lot Traceability
and Date Code
Part # Code
G1
G2
S1
N-Channel MOSFET
S2
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150_C)a
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)b, c
TA = 25_C
TA = 85_C
TA = 25_C
TA = 85_C
VDS
VGS
ID
IDM
IS
PD
TJ, Tstg
ï§4.2
ï§3.0
1.8
2.1
1.1
20
ï§12
ï§10
--55 to 150
260
ï§3.1
ï§2.2
0.9
1.1
0.6
Unit
V
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
t ⤠5 sec
50
Steady State
RthJA
90
Steady State
RthJF
30
60
110
_C/W
40
Notes
a. Surface Mounted on 1â x 1â FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-
nection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71065
S-21251âRev. B, 05-Aug-02
www.vishay.com
2-1
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