SI5459DU Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET

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Si5459DU
Vishay Siliconix
P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
-20
R_DS(on) ()
0.052 at V_GS = -4.5 V
0.082 at V_GS = -2.5 V
I_D (A) ^a
-8 ^e
-7.5
Q_g (TYP.)
8
PowerPAK^® ChipFET^® Single
D
S
D
6
D
7
8
5
1 _3.0 ^mm
Top View
1
S
9
4
3
D
2
D
D
G
Bottom View
FEATURES
• TrenchFET^® power MOSFET
• 100 % R_g tested
• Material categorization: 
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
S
• Load switch
• HDD DC/DC
G
Ordering Information: 
Si5459DU-T1-GE3 (Lead (Pb)-free and halogen-free)
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (10 μs pulse width)
I_DM
Source-Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_J, T_stg
D
P-Channel MOSFET
LIMIT
-20
± 12
-8 ^e
-8 ^e
-6.7 ^{b, c}
-5.3 ^{b, c}
-20
-8 ^e
-2.9 ^{b, c}
10.9
7
3.5 ^{b, c}
2.2 ^{b, c}
-50 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
LIMIT
TYPICAL MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, d}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
30
Steady State
R_thJC
9.5
36
°C/W
11.5
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 72 °C/W.
e. Package limited.
f. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
g. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
S16-0980-Rev. C, 23-May-16
1
Document Number: 65017
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000