SI5404BDC_08 Datasheet, PDF (1/6 Pages) Vishay Siliconix – N-Channel 2.5-V (G-S) MOSFET

New Product
N-Channel 2.5-V (G-S) MOSFET
Si5404BDC
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
20
r_DS(on) (W)
0.028 @ V_GS = 4.5 V
0.039 @ V_GS = 2.5 V
I_D (A)
7.5
6.3
Q_g (Typ)
6.3
FEATURES
D TrenchFETr Power MOSFET
1206-8 ChipFETr
1
D
D
D
D
D
D
G
S
Bottom View
Ordering Information: Si5404BDC-T1—E3
D
Marking Code
AE XXX
Lot Traceability
and Date Code
Part # Code
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150_C)^a
Pulsed Drain Current
Continuous Source Current (Diode Conduction)^a
Maximum Power Dissipation^a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{b, c}
T_A = 25_C
T_A = 85_C
T_A = 25_C
T_A = 85_C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
20
"12
7.5
5.4
5.4
3.9
20
2.1
1.1
2.5
1.3
1.3
0.7
−55 to 150
260
Unit
V
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^a
Maximum Junction-to-Foot (Drain)
t v 5 sec
45
Steady State
R_thJA
80
Steady State
R_thJF
18
50
95
_C/W
22
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-
nection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73102
S-41826—Rev. A, 11-Oct-04
www.vishay.com
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