SB2D Datasheet, PDF (1/4 Pages) Vishay Siliconix – Glass passivated chip junction

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SB2D thru SB2M
Vishay General Semiconductor
Surface Mount Glass Passivated Rectifier
DO-214AA (SMB)
FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Low forward voltage drop
• Low leakage current
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
I_F(AV)
V_RRM
I_FSM
I_R
V_F at I_F = 2.0 A
T_J max.
Package
2.0 A
200 V to 1000 V
55 A
1.0 μA
0.86 V
150 °C
DO-214AA (SMB)
Diode variations
Single die
TYPICAL APPLICATIONS
For use in general purpose rectification of power supplies,
inverters, converters and freewheeling diodes for consumer
and telecommunication.
MECHANICAL DATA
Case: DO-214AA (SMB)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS compliant, and
commercial grade
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (T_A = 25 °C unless otherwise noted)
PARAMETER
SYMBOL SB2D
Device marking code
B2D
Maximum repetitive peak reverse voltage
V_RRM
200
Maximum DC forward current (fig. 1)
I_F ⁽¹⁾
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load
I_FSM
Operating and storage temperature range
T_J, T_STG
Note
(1) _{Mounted on 8 mm x 8 mm pad areas, 1 oz. FR4 PCB}
SB2G
B2G
400
SB2J
B2J
600
2.0
SB2K
B2K
800
55
-55 to +150
SB2M
B2M
1000
UNIT
V
A
A
°C
Revision: 03-Nov-11
1
Document Number: 89461
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000