SA_15 Datasheet, PDF (1/3 Pages) Vishay Siliconix – Current Sensing Wirebondable Thin Film Chip Resistors

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SA, SB, SC
Vishay Sfernice
Current Sensing Wirebondable Thin Film Chip Resistors
This thin film chip resistor fits applications as force balance
scales, E beam deflection systems, switching power
supplies, etc... all rely on current sensors to feed back and
control the current.
Gold pads are compatible with thermosonic or ultrasonic
bonding of gold and aluminum wires.
FEATURES
• Low ohmic value down to 0.05 
• Tolerance down to 1 %
• Stability 0.1 % < 2000 h at Pn at +70 °C
• Low noise < -35 dB
• Low TCR 100 ppm/°C
• Wirebondable
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE
RANGE

SA
0606
0.05 to 1
SB
1212
0.05 to 1
SC
2020
0.05 to 1
RATED POWER
P_{70 °C}
W
0.5
2
6
TOLERANCE
±%
1, 2, 5
1, 2, 5
1, 2, 5
TEMPERATURE
COEFFICIENT
± ppm/°C
100
100
100
CLIMATIC SPECIFICATIONS
Operating temperature range
-55 °C to +125 °C
Storage temperature range
-55 °C to +155 °C
MECHANICAL SPECIFICATIONS
Substrate
Alumina
Resistive element
NiCr
Glassivation
Bonding pads
Ta₂O₅
Gold
Backside metallization
On request Ni Au
DERATING CURVE
120
100
80
60
40
20
0
0
20
40
60
80 100 120 140
Ambient Temperature in °C
TOLERANCE VS. OHMIC VALUE
OHMIC VALUE RANGE

0.05  R < 1
0.2  R < 1
0.5  R < 1
TOLERANCE
±%
5
2
1
Note
• Higher values and higher tolerances on request.
Revision: 13-Mar-15
1
Document Number: 53013
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000