SA Datasheet, PDF (1/3 Pages) Taiwan Semiconductor Company, Ltd – Transient Voltage Suppressor Diodes

SA, SB, SC
Vishay Sfernice
Current Sensing Bondable
Chip Resistors
FEATURES
• Low ohmic value down to 0.05 Ω
• Tolerance down to 1 %
• Stability 0.1 % < 2000 h at Pn at + 70 °C
• Low noise < 35 dB
• Low TCR 100 ppm/°C
• Wirebondable
This thin film chip resistor fits applications as force balance
scales, E beam deflection systems, switching power
supplies, etc... all rely on current sensors to feed back and
control the current.
Gold pads are compatible with thermosonic or ultrasonic
bonding of gold and aluminium wires.
DIMENSIONS in millimeters
A
C
0.4
B
C
SERIES DISSIPATION
SA
SB
SC
POWER
0.5 W
2W
6W
DIMENSIONS
A
B
C
1.5
1.5
0.2
3
3
0.4
5
5
0.5
ELECTRICAL SPECIFICATIONS
Ohmic values and
associated tolerance:
0.05 Ω ≤ R < 0.2 Ω ± 5 %
0.2 Ω ≤ R < 0.5 Ω ± 2 %
0.5 Ω ≤ R < 1 Ω ± 1 %
higher values and higher
tolerances on request
Power dissipation at + 70 °C: SA: 0.5 W
SB: 2 W
SC: 6 W
Temperature coefficient:
± 100 ppm/°C
± 50 ppm/°C on request
Noise:
- 35 dB maximum
Low ohmic value chip resistors are also available with
solderable or weldable wraparound terminations.
MECHANICAL SPECIFICATIONS
Substrate:
Resistive element:
Glassivation:
Bonding pads:
Backside metallization:
Alumina
NiCr
Ta₂O₅
gold
on request Ni Au
ENVIRONMENTAL SPECIFICATIONS
Operating
temperature range:
- 55 °C to + 125 °C
Storage temperature:
- 55 °C to + 155 °C
For standard sizes see our data sheet P Document Number:
53017 and ask us about performance.
* Please see document “Vishay Green and Halogen-Free Definitions (5-2008)” http://www.vishay.com/doc?99902
www.vishay.com
38
For technical questions, contact: [e-mail]
Document Number: 53013
Revision: 06-Oct-08