PLZ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Zener Diodes Permitting 500 mW Power Dissipation

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PLZ Series
Vishay Semiconductors
Zener Diodes Permitting 500 mW Power Dissipation
1
2
20278
PRIMARY CHARACTERISTICS
PARAMETER
VALUE
V_Z range nom.
Test current I_ZT
V_Z specification
Int. construction
2.0 to 39
5 to 20
Pulse current
Single
UNIT
V
mA
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
PLZ-Series
Part number-G3/H
PLZ-Series
Part number-HG3/H
FEATURES
• Sillicon planar Zener diodes, ultra small
• Low profile DO-219AC (MicroSMF) package
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C / 10 s at
terminals
• Wave and reflow solderable (reflow as per
JPC / JEDEC^® J-STD 020) (double wave as
per IEC 61760-1)
• AEC-Q101 qualified available
• Base P/N-G3 - RoHS-compliant, green, industrial grade
• Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
• ESD immunity acc. IEC 61000-4-2 acc. to part table
• Surge performance acc. to part table
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TAPED UNITS PER REEL
4500 per 7" reel (8 mm tape)
MINIMUM ORDER QUANTITY
22 500 / box
PACKAGE
PACKAGE NAME
DO-219AC (MicroSMF)
WEIGHT
4.8 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY LEVEL
MSL level 1 (according J-STD-020)
SOLDERING CONDITIONS
260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS (T_amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Power dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T_amb = 85 °C
Power dissipation
Power dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T_amb = 25 °C
Mounted on FR4 board with recommended soldering
footpads (reflow)
Non-repetitive peak surge power dissipation ^{tp = 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D)}
t_p = 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C)
Z-current
Junction temperature
Storage temperature range
SYMBOL
P_tot
P_tot
P_tot
P_ZSM
P_ZSM
I_Z
T_j
T_stg
VALUE
500
960
340
100
70
P_tot/V_Z
150
-55 to +150
UNIT
mW
W
W
mA
°C
THERMAL CHARACTERISTICS (T_amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Typ. thermal resistance junction to ambient air
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm
Typ. thermal resistance junction to lead
SYMBOL
R_thJA
R_thJL
VALUE
130
40
UNIT
K/W
K/W
ELECTRICAL SPECIFICATIONS (T_amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL MIN.
Forward Voltage
I_F = 10 mA
V_F
TYP.
0.8
MAX.
0.9
UNIT
V
Rev. 1.2. 29-Nov-16
1
Document Number: 84830
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000