NTCC200E4 Datasheet, PDF (1/3 Pages) Vishay Siliconix – Leadless NTC Thermistor Die Suitable for Wire Bonding

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NTCC200E4, NTCC300E4
Vishay BCcomponents
Leadless NTC Thermistor Die Suitable for Wire Bonding
QUICK REFERENCE DATA
PARAMETER
VALUE
Resistance value at 25 °C
4.7K to 20K
Tolerance on R₂₅-value
B_25/85-value
Tolerance on B_25/85-value
Operating temperature range
± 1 to ± 5
3435 to 3865
±1
-55 to +175
Response time (63.2 %)
25 °C to 85 °C still air (for info)
3
Dissipation factor  in still air
(for info, non-mounted die)
3
Maximum power dissipation
50
Weight
3
DIMENSIONS in millimeters
W
T
UNIT

%
K
%
°C
s
mW
mW
mg
Wire bondable surface
PARAMETER
W
T
VALUE
2 ± 0.1
0.7 max.
Note
• Non-dimensioned details do not affect the performance of the
thermistors.
FEATURES
• Flat chip contacted top and bottom
(gold: NTCC300E4 series or silver: NTCC200E4
series)
• Green thermistor - does not use RoHS
exemptions
• Wide temperature range from -55 °C to +175 °C
• Highly resistant to thermal shocks
• Ideal for wire bonding (aluminum or gold
depending on metalization type)
• Resistance to leaching
• Delivered on blister tape
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• High temperature sensing, control and compensation.
E.g. IGBT modules (inverters in EV and HEV vehicles)
• IC and semiconductor protecting
• DC/AC power inverters and HIC overheat protecting
MOUNTING
The thermistors are primarily intended for wire bonding. The
parameters of the assembly process should be chosen in
accordance with the lead-wire material.
The mounting process should be in compliance with the
following guidelines and recommendations:
Die bonding:
• Gold electrode: silver epoxy gluing.
• Silver electrode: (vacuum) reflow soldering - silver epoxy
gluing - nano silver sintering.
Cleaning:
• Detergent spraying.
• Ultrasonic or formic acid vapor cleaning is not
recommended.
Wire bonding:
• The gold electrode has been tested for gold wire bonding
with a wire diameter of max. 32 μm.
• The silver electrode has been tested for aluminum wire
bonding with a wire diameter of max. 300 μm.
Encapsulation:
• In order to preserve the characteristics of the bonded die
at long term an encapsulation is mandatory.
• The encapsulation is defined by the user. Silicon and
epoxy encapsulations have been tested. For
recommendations on compatible encapsulants contact
Vishay.
ELECTRICAL DATA AND ORDERING INFORMATION
VISHAY SAP
ORDERING NUMBER ⁽¹⁾
R₂₅-VALUE R₂₅-VALUE B_25/85-VALUE B_25/85-TOL.
(k)
(%)
(K)
(%)
DESCRIPTION
NTCC200E4472*T
4.7
1, 2, 3, 5
3435
1
Bare die with top /bottom silver terminations
NTCC200E4123*T
12
1, 2, 3, 5
3740
1
Bare die with top /bottom silver terminations
NTCC200E4203*T
20
1, 2, 3, 5
3865
1
Bare die with top /bottom silver terminations
NTCC300E4472*T
4.7
1, 2, 3, 5
3435
1
Bare die with top /bottom gold terminations
NTCC300E4123*T
12
1, 2, 3, 5
3740
1
Bare die with top /bottom gold terminations
NTCC300E4203*T
20
1, 2, 3, 5
3865
1
Bare die with top /bottom gold terminations
Note
(1) _{In order to define R25-tolerance, replace * in SAP part number by F (± 1 %) , G (± 2 %) , H (± 3 %) of J (± 5 %).}
Revision: 13-Oct-15
1
Document Number: 29153
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000