LH1501BAB_11 Datasheet, PDF (1/4 Pages) Vishay Siliconix – 1 Form B Solid State Relay

LH1501BAB, LH1501BABTR, LH1501BT
Vishay Semiconductors
1 Form B Solid State Relay
SMD
DIP
S'
S'
S DC S'
6 54
1 23
i179041-2
DESCRIPTION
The LH1501 relays are SPST normally closed switches
(1 form B) that can replace electromechanical relays in many
applications. The relays are constructed as a multi-chip
hybrid device. Actuation control is via an infrared LED. The
output switch is a combination of a photodiode array with
MOSFET switches and control circuity. The relays can be
configured for AC/DC or DC only operation.
ORDERING INFORMATION
L
H
1
5
0
1
B
FEATURES
• Isolation test voltage 3750 V_RMS
• Typical R_ON 20 
• Load voltage 350 V
• Clean bounce free switching
• Low power consumption
• SMD lead available on tape and reel
• Compliant to RoHS Directive 2002/95/EC and
in accordance to WEEE 2002/96/EC
APPLICATIONS
• General telecom switching
• Security equipment
• Instrumentation
• Industrial controls
AGENCY APPROVALS
UL1577: file no. E52744
CSA: certification 093751
DIP
SMD
#
#
T
R
PART NUMBER
PACKAGE
SMD-6, tubes
SMD-6, tape and reel
DIP-6, tubes
ELECTR. PACKAGE
VARIATION CONFIG.
TAPE AND
REEL
7.62 mm
UL, CSA
LH1501BAB
LH1501BABTR
LH1501BT
> 0.1 mm
ABSOLUTE MAXIMUM RATINGS (T_amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
INPUT
LED continuous forward current
LED reverse voltage
OUTPUT
I_R  10 μA
I_F
50
mA
V_R
5
V
DC or peak AC load voltage
Continuous DC load current - bidirectional
Continuous DC load current - unidirectional
Peak load current (single shot)
SSR
I_L  50 μA
t = 100 ms
V_L
350
V
I_L
150
mA
I_L
200
mA
I_P
350
mA
Ambient temperature range
Storage temperature range
Pin soldering temperature ⁽¹⁾
Input to output isolation voltage
Output power dissipation (continuous)
t = 10 s max.
t = 1 s, I_ISO = 10 μA max.
T_amb
T_stg
T_sld
V_ISO
P_diss
- 40 to + 85
- 40 to + 125
260
3750
550
°C
°C
°C
V_RMS
mW
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) _{Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through}
hole devices (DIP).
Document Number: 83805
Rev. 1.7, 20-May-11
For technical questions, contact: [e-mail]
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000