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IRL640S Datasheet, PDF (1/9 Pages) International Rectifier – HEXFET-R POWER MOSFET | |||
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www.vishay.com
IRL640S, SiHL640S
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) (ï)
Qg max. (nC)
Qgs (nC)
Qgd (nC)
Configuration
200
VGS = 5 V
66
9.0
38
Single
0.18
D
D2PAK (TO-263)
FEATURES
⢠Surface mount
⢠Available in tape and reel
⢠Dynamic dV/dt rating
⢠Repetitive avalanche rated
Available
⢠Logic-level gate drive
⢠RDS(on) specified at VGS = 4 V and 5 V
⢠Fast switching
Available
⢠Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
Noteï
* This datasheet provides information about parts that areï
RoHS-compliant and / or parts that are non-RoHS-compliant. Forï
example, parts with lead (Pb) terminations are not RoHS-compliant.ï
Please see the information / tables in this datasheet for details.
GD
S
G
S
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.ï
The D2PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
D2PAK (TO-263)
SiHL640S-GE3
IRL640SPbF
SiHL640S-E3
D2PAK (TO-263)
SiHL640STRL-GE3 a
IRL640STRLPbF a
SiHL640STL-E3 a
D2PAK (TO-263)
SiHL640STRR-GE3 a
IRL640STRRPbF a
SiHL640STR-E3 a
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current a
Linear Derating Factor
VDS
VGS
VGS at 5.0 V
TC = 25 °C
TC = 100 °C
ID
IDM
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Repetitive Avalanche Current a
Repetitive Avalanche Energy a
Maximum Power Dissipation
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
TC = 25 °C
TA = 25 °C
EAS
IAR
EAR
PD
dV/dt
Operating Junction and Storage Temperature Range
Soldering Temperature d
for 10 s
TJ, Tstg
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 3.0 mH, Rg = 25 ï, IAS = 17 A (see fig. 12).
c. ISD ï£ 17 A, dI/dt ï£ 150 A/μs, VDD ï£ VDS, TJ ï£ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1â square PCB (FR-4 or G-10 material).
LIMIT
200
± 10
17
11
68
1.0
0.025
580
10
13
125
3.1
5.0
-55 to +150
300
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
S16-0763-Rev. D, 02-May-16
1
Document Number: 91306
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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