FCSP130LTR Datasheet, PDF (1/5 Pages) Vishay Siliconix – Chip Scale Package Schottky Barrier Rectifier

FCSP130LTR
Vishay High Power Products
FlipKY^®, 1 A
Chip Scale Package Schottky Barrier Rectifier
FEATURES
• Ultra low V_F per footprint area
• Low leakage
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (0.6 mm)
• Available tested on tape and reel
RoHS
COMPLIANT
FlipKY^®
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
PRODUCT SUMMARY
I_F(AV)
V_R
1A
30 V
DESCRIPTION
Vishay's FlipKY^® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest V_F to PCB footprint area in industry. The four
bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy
only 2.3 mm² of board space. The anode and cathode
connections are made through solder bump pads on one
side of the silicon enabling designers to strategically place
the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
V_RRM
I_F(AV)
I_FSM
Rectangular waveform
V_F
1 Apk, T_J = 125 °C
T_J
MAX.
30
1
250
0.33
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
FCSP130LTR
30
UNITS
V
Document Number: 94494
Revision: 02-Jul-08
For technical questions, contact: [e-mail]
www.vishay.com
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