FCSP130ETR Datasheet, PDF (1/5 Pages) Vishay Siliconix – surface mount Schottky rectifier

FlipKY^®, 1 A
FCSP130ETR
Vishay High Power Products
FlipKY^®
PRODUCT SUMMARY
I_F(AV)
1A
V_R
30 V
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
I_F(AV)
V_RRM
Rectangular waveform
I_FSM
t_p = 5 µs sine
V_F
1.0 Apk, T_J = 125 °C
T_J
Range
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
FEATURES
• Ultralow V_F per footprint area
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (< 0.7 mm)
• Available tested on tape and reel
• Small footprint, surface mountable
• Low forward voltage drop
• High frequency operation
• Guard ring for enhanced ruggedness and long term
reliability
• Designed for consumer level
DESCRIPTION
True chip-scale packaging is available from Vishay HPP.
The FCSP130ETR surface mount Schottky rectifier has
been designed for applications requiring low forward drop
and very small footprints on PC boards. Typical applications
are in disk drives, switching power supplies, converters,
freewheeling diodes, battery charging, and reverse battery
protection.
The FlipKY^® package, is one-fifth the footprint of a
comparable SMA package and has a profile of less then
0.7 mm. Combined with the low thermal resistance of the die
level device, this makes the FlipKY the best device for
applications where printed circuit board space is at a
premium and in extremely thin application environments
such as battery packs, cell phones and PCMCIA cards.
VALUES
1.0
30
220
0.33
- 55 to 150
UNITS
A
V
A
V
°C
FCSP130ETR
30
UNITS
V
Document Number: 93431
Revision: 26-Aug-08
For technical questions, contact: [e-mail]
www.vishay.com
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