FCSP05H40TR Datasheet, PDF (1/5 Pages) Vishay Siliconix – Chip Scale Package Schottky Barrier Rectifier, 0.5 A

FCSP05H40TR
Vishay High Power Products
FlipKY^®
Chip Scale Package Schottky Barrier Rectifier, 0.5 A
FEATURES
• Ultra low V_F to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
RoHS
COMPLIANT
FlipKY^®
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
PRODUCT SUMMARY
I_F(AV)
V_R
0.5 A
40 V
DESCRIPTION
Vishay's FlipKY^® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest V_F to PCB footprint area in industry. The three
pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and
occupy only 1.08 mm² of board space. The anode and
cathode connections are made through solder bump pads on
one side of the silicon enabling designers to strategically
place the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
V_RRM
I_F(AV)
I_FSM
V_F
T_J
Rectangular waveform
0.5 Apk, T_J = 125 °C
MAX.
40
0.5
190
0.42
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
FCSP05H40TR
40
UNITS
V
Document Number: 94491
Revision: 22-Aug-07
For technical questions, contact: [e-mail]
www.vishay.com
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