FCSP0530TR Datasheet, PDF (1/5 Pages) Vishay Siliconix – Chip Scale Package Schottky Barrier Rectifier, 0.5 A

FCSP0530TR
Vishay High Power Products
FlipKY^®
Chip Scale Package Schottky Barrier Rectifier, 0.5 A
FEATURES
• Ultra low V_F to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
RoHS
COMPLIANT
FlipKY^®
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
PRODUCT SUMMARY
I_F(AV)
V_R
0.5 A
30 V
DESCRIPTION
Vishay's FlipKY^® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest V_F to PCB footprint area in industry. The three pad
0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy
only 1.08 mm² of board space. The anode and cathode
connections are made through solder bump pads on one
side of the silicon enabling designers to strategically place
the diodes on the PCB. This design not only minimizes board
space but also reduces thermal resistance and inductance,
which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
V_RRM
I_F(AV)
Rectangular waveform
I_FSM
V_F
0.5 Apk, T_J = 125 °C
T_J
MAX.
30
0.5
190
0.33
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
FCSP0530TR
30
UNITS
V
Document Number: 94492
Revision: 22-Aug-07
For technical questions, contact: [e-mail]
www.vishay.com
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