FCSP0530ETR Datasheet, PDF (1/5 Pages) Vishay Siliconix – chip scale packaging to deliver Schottky diodes

FlipKY^®, 0.5 A
FCSP0530ETR
Vishay High Power Products
FlipKY^®
PRODUCT SUMMARY
I_F(AV)
V_R
0.5 A
30 V
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
I_F(AV)
Rectangular waveform
V_RRM
I_FSM
t_p = 5 µs sine
V_F
0.5 Apk, T_J = 125 °C
T_J
Range
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V_R
V_RWM
FEATURES
• Ultralow V_F to footprint area
• Very low profile (< 0.6 mm )
• Low thermal resistance
• Supplied tested and on tape and reel
• Designed for consumer level
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
DESCRIPTION
FlipKY^® product family utilizes wafer level chip scale
packaging to deliver Schottky diodes with the lowest
V_F to PCB footprint area in the industry. The three
pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and
occupy only 1.08 mm² of board space. The anode and
cathode connections are made through solder bump pads on
one side of the silicon rather than through protruding leads
enabling designers to strategically place the diodes on the
PCB. This design not only minimizes board space but also
reduces thermal resistance and inductance, which can
improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, PDAs, and portable hard
disk drives where space savings and performance are
crucial.
VALUES
0.5
30
190
0.33
- 55 to 150
UNITS
A
V
A
V
°C
FCSP0530ETR
30
UNITS
V
Document Number: 93429
Revision: 26-Aug-08
For technical questions, contact: [e-mail]
www.vishay.com
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