EB7D Datasheet, PDF (1/4 Pages) Vishay Siliconix – Edgeboard Connectors, Dual Readout

EB7D
Vishay Dale
Edgeboard Connectors, Dual Readout
ELECTRICAL SPECIFICATIONS
Current Rating: 5 amps.
Test Voltage Between Contacts:
At sea level: 1800VRMS.
At 70,000 feet [21,336 meters]: 450VRMS.
Insulation Resistance: 5000 Megohm minimum at 500VDC
potential.
Contact Resistance: 30 millivolts maximum at rated current
(with gold plating).
Operating Temperature: - 55°C to + 125°C.
Humidity: 96 hours at 90% relative humidity at + 40°C, dried
at room temperature for 3 hours minimum, insulation
resistance 5000 Megohm.
Durability: (With gold plating.) After 500 cycles of insertion
and withdrawal of 0.070" [1.78mm] thick steel test gauge,
contact resistance less than 0.030V at 5 amps and individual
contact retention force when measured with a 0.054" [1.37mm]
thick steel test slug greater than 1/2 ounce.
Shock: Three 50g shocks in each of 3 mutually perpendicular
planes with no loss of continuity.
Vibration: 2 hours in each of 3 mutually perpendicular planes,
frequency sweep 10 to 55cps at 0.06 double amplitude with
no loss of continuity.
PHYSICAL SPECIFICATIONS
Contact Type: Bifurcated bellows.
Number of Contacts: 6, 10, 12, 15, 18, 22, 36, 43 per side.
Contact Spacing: 0.156" [3.96mm] center to center.
Card Thickness: 0.054" to 0.071" [1.37mm to 1.80mm].
Card Slot Depth: Dual Readout = 0.260" [6.60mm].
NOTE: High temperature burn-in, edgeboard connectors,
0.156" [3.96mm] center to center are on page 20 of this catalog.
FEATURES
• 0.156" C-C x 0.140" grid [3.96mm x 3.56mm].
• Bifurcated bellows contacts provide 2 flexing contact
surfaces to assure positive contact under adverse conditions
such as vibration or PC board irregularities.
• Accepts PC board thickness of 0.054" - 0.071"
[1.37mm -1.80mm].
• Polarization between contact positions in all sizes.
Between contact polarization permits polarizing without loss
of a contact position.
• Selective gold plating.
• Polarizing key is reinforced nylon, may be inserted by hand,
requires no adhesive.
• Protected entry, provided by recessed leading edge of
contact, permits the card slot to straighten and align the
board before electrical contact is made. Prevents damage
to contact which might be caused by warped or out of
tolerance boards.
• Recognized under the Component Program of
Underwriters Laboratories, Inc. Listed under File
E65524, Project 77CH3889.
APPLICATIONS
For use with 0.062" [1.57mm] printed circuit boards requiring
an edgeboard type connector on 0.156" [3.96mm] centers.
MATERIAL SPECIFICATIONS
Body: (Standard) Glass-filled phenolic per MIL-M-14, dark
green, flame retardant (UL 94V-0). (Optional - See Ordering
Information):
“1” glass-filled diallyl phthalate per MIL-M-14, Type SDG-F
green, flame retardant (UL 94V-0).
“3” thermoplastic polyester, glass-filled, black, flame retardant
(UL 94V-0).
“5” thermoplastic polyphenylene sulfied, glass filled, brown,
flame retardant (UL 94V-0).
Contacts: Phosphor bronze.
Polarizing Key: Glass reinforced nylon, flame retardant (UL 94H-B).
Contact Plating: Gold (See Ordering Information).
ORDERING INFORMATION
EB7
1
D
B
A
MODEL
BODY
DUAL
OPTIONAL STANDARD
MATERIAL READOUT CONTACTS TERMINAL
Optional Body
Material
1 = Diallyl Phthalate.
3 = Glass-filled
Polyester.
5 = Glass-filled
Polyphenylene
VARIATIONS
Beryllium Copper _{A, E,}
contacts optional. _{C or K}
Available in “A” and
“E” contact styles
only. (Omit for
standard.)
Sulfied.
Omit for
standard
phenolic.
22
CONTACTS
SG
CONTACT
PLATING
X
MOUNTING
VARIATIONS
SG = Selective Gold
6, 10, 12, Plating (0.00003"
15, 18, 22, [0.000762mm] minimum
36 or 43 thick) on contact area with
Gold Flash on terminal.
SGF = Selective Gold
Plating (0.00001"
[0.000254mm] minimum
thick) on contact area with
Gold Flash on terminal.
All Gold Plating over
0.00005" [0.00127mm]
minimum, Nickel
Underplate.
Contact factory for
additional plating options.
A
POLARIZING
KEY
POSITIONS
Key(s) are
located to right
of position(s)
designated.
Required only
when polarizing
keys are to be
factory installed.
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8
For technical questions, contact [e-mail]
Document Number 36003
Revision 14-Aug-02