DCRCWP Datasheet, PDF (1/6 Pages) Vishay Siliconix – Lead (Pb)-Bearing Thick Film, Rectangular, Semi-Precision Chip Resistors

www.vishay.com
D/CRCW-P
Vishay
Lead (Pb)-Bearing Thick Film, Rectangular,
Semi-Precision Chip Resistors
FEATURES
• Low temperature coefficient (50 ppm/K) and tight
tolerances (± 0.25 %)
• Lead (Pb)-bearing termination plating on Ni barrier layer
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P₇₀
W
LIMITING
ELEMENT
VOLTAGE
U_max.
AC_RMS/DC
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE

SERIES
D10/CRCW0402-P 0402
1005
0.063
50
± 100
± 50
± 100
± 0.5
± 0.25, ± 0.5, ± 1
± 0.5
10 to 1M
100 to 1M
10 to 10M
E24; E96
D11/CRCW0603-P 0603 1608
0.1
75
± 50
± 100
± 0.25
± 0.5, ± 1
± 0.5
100 to 1M
100 to 10M
10 to 10M
E24; E96
D12/CRCW0805-P 0805
2012
0.125
150
± 50
± 100
± 0.25
± 0.5, ± 1
± 0.5
100 to 1M
100 to 10M
10 to 10M
E24; E96
D25/CRCW1206-P 1206 3216
0.25
200
CRCW1210-P
1210 3225
0.5
200
± 50
± 100
± 50
± 0.25
± 0.5, ± 1
± 0.5
± 0.5, ± 1
100 to 1M
100 to 10M
100 to 1M
100 to 1M
E24; E96
E24; E96
CRCW1218-P
1218 3246
1.0
200
± 100
± 50
± 0.5
± 0.5, ± 1
100 to 2.2M
100 to 2.2M
E24; E96
CRCW2010-P
2010 5025
0.75
400
CRCW2512-P
2512 6332
1.0
500
± 100
± 50
± 100
± 50
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
10 to 10M
100 to 10M
10 to 10M
100 to 10M
E24; E96
E24; E96
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020).
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Revision: 21-Jan-14
1
Document Number: 20009
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000