CWR11DH106KB Datasheet, PDF (1/7 Pages) Vishay Siliconix – Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT Molded Case, Military MIL-PRF-55365/8 Qualified

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CWR11
Vishay Sprague
Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT^® Molded Case, Military MIL-PRF-55365/8 Qualified
PERFORMANCE/ELECTRICAL
CHARACTERISTICS
www.vishay.com/doc?40088
Operating Temperature: - 55 °C to + 125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 0.10 μF to 100 μF
Capacitance Tolerance: ± 5 %, ± 10 %, ± 20 %
Voltage Rating: 4 V_DC to 50 V_DC
FEATURES
• Weibull failure rate codes B, C, D and T
• Surge current options A, B and C
• Termination: H = Solder plated, K = Solder fused
• Molded case available in four case codes
• Compatible with “High Volume” automatic pick and place
equipment
APPLICATIONS
• Military/aerospace
• General purpose
• High reliability
ORDERING INFORMATION
CWR11
D
H
TYPE VOLTAGE TERMINATION
FINISH
155
CAPACITANCE
K
CAPACITANCE
TOLERANCE
B
FAILURE RATE
%/1000 h
A
SURGE CURRENT
(OPTIONAL)
/HR
PACKAGING
OPTION
C=4V
D=6V
F = 10 V
H = 15 V
J = 20 V
K = 25 V
M = 35 V
N = 50 V
H = Solder
plated
K = Solder
fused
This is expressed
in picofarads.
The first two digits
are the significant
figures. The third
is the number of
zeros to follow.
J=±5%
K = ± 10 %
M = ± 20 %
M = 1.0
P = 0.1
R = 0.01
S = 0.001
B = 0.1
C = 0.01
D = 0.001
T = 0.01 ⁽¹⁾
A = 3 cycles
at + 25 °C
B = 3 cycles
at - 55 °C/+ 85 °C
C = 3 cycles
at - 55 °C/+ 85 °C
(before Weibull
grading)
Blank = Full reel
/PR = 100 pcs reel
/HR = half reel
/PT = Bulk,
plastic tray
/FA = Waffle pack
Note
(1) _{T level capacitors are recommended for “Space applications”. Shipped in tape and reel/or waffle packaging only.}
DIMENSIONS in inches [millimeters]
L
T_H MIN.
Glue Pad
W
H
T_W
Glue Pad
P
CASE CODE
A
B
C
D
EIA SIZE
3216-18
3528-21
6032-28
7343-31
L
0.126 ± 0.008
[3.2 ± 0.20]
0.138 ± 0.008
[3.5 ± 0.20]
0.236 ± 0.012
[6.0 ± 0.30]
0.287 ± 0.012
[7.3 ± 0.30]
W
0.063 ± 0.008
[1.6 ± 0.20]
0.110 ± 0.008
[2.8 ± 0.20]
0.126 ± 0.012
[3.2 ± 0.30]
0.170 ± 0.012
[4.3 ± 0.30]
H
0.063 ± 0.008
[1.6 ± 0.20]
0.075 ± 0.008
[1.9 ± 0.20]
0.098 ± 0.012
[2.5 ± 0.30]
0.110 ± 0.012
[2.8 ± 0.30]
P
0.031 ± 0.012
[0.80 ± 0.30]
0.031 ± 0.012
[0.80 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option).
T_W
0.047 ± 0.004
[1.2 ± 0.10]
0.087 ± 0.004
[2.2 ± 0.10]
0.087 ± 0.004
[2.2 ± 0.10]
0.095 ± 0.004
[2.4 ± 0.10]
T_H MIN.
0.028
[0.70]
0.028
[0.70]
0.039
[1.0]
0.039
[1.0]
Revision: 26-Jun-13
1
Document Number: 40011
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000