BZD27C3V6P-E3-08 Datasheet, PDF (1/8 Pages) Vishay Siliconix – Zener Diodes with Surge Current Specification

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BZD27 Series
Vishay Semiconductors
Zener Diodes with Surge Current Specification
17249
PRIMARY CHARACTERISTICS
PARAMETER
VALUE
V_Z range nom.
Test current I_ZT
V_BR
V_WM
P_PPM
T_J max.
V_Z specification
Int. construction
Polarity
3.6 to 200
5 to 100
7 to 188
6.2 to 160
150
150
Pulse current
Single
Uni-directional
UNIT
V
mA
V
V
W
°C
FEATURES
• Sillicon planar Zener diodes
Available
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
• Excellent stability
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
• Meets JESD 201 class 2 whisker test
• ESD capability according to AEC-Q101:
human body model: > 8 kV
machine model: > 800 V
• Wave and reflow solderable
• AEC-Q101 qualified
• Base P/N-E3 - RoHS-compliant, commercial grade
• Base P/N-HE3 - RoHS-compliant, automotive grade
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
BZD27 Series
BZD27C3V6P-E3-08 to BZD27C200P-E3-08
BZD27C3V6P-HE3-08 to BZD27C200P-HE3-08
BZD27C3V6P-E3-18 to BZD27C200P-E3-18
BZD27C3V6P-HE3-18 to BZD27C200P-HE3-18
TAPED UNITS PER REEL
3000 per 7" reel (8 mm tape)
10 000 per 13" reel (8 mm tape)
MINIMUM ORDER QUANTITY
30 000/box
50 000/box
PACKAGE
PACKAGE NAME
DO-219AB (SMF)
WEIGHT
15 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY
LEVEL
MSL level 1
(according J-STD-020)
WHISKER TEST
ACC. JESD 201
class 2
SOLDERING CONDITIONS
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS (T_amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
Power dissipation
Non repetitive peak surge power dissipation ⁽²⁾
T_L = 80 °C
T_A = 25 °C ⁽¹⁾
100 μs square pulse
10/1000 μs waveform
Junction to lead
Junction to ambient air
Mounted on epoxy-glass PCB with
3 mm x 3 mm Cu pads
( 40 μm thick)
Junction temperature
Storage temperature range
Operating temperature range
Notes
(1) _{Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)}
(2) _{TJ = 25 °C prior to surge}
P_tot
P_tot
P_ZSM
P_RSM
R_thJL
R_thJA
T_j
T_stg
T_op
VALUE
2300
800
300
150
30
180
150
-55 to +150
-55 to +150
UNIT
mW
mW
W
W
K/W
K/W
°C
°C
°C
Rev. 1.2, 13-Aug-14
1
Document Number: 85153
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