80-M3126BA140SC02-K489G40 Datasheet, PDF (5/21 Pages) Vincotech – Solderless interconnection

80-M3126BA140SC02-K489G40
datasheet
Parameter
Brake FWD
Static
Forward voltage
Reverse leakage c urrent
Thermal
Thermal resistance chip to heatsink
FWD Switching
Peak recovery current
Reverse recovery time
Recovered charge
Reverse recovered energy
Peak rate of fall of recovery current
Rectifier Diode
Static
Forward voltage
Reverse leakage current
T hermal
Thermal resistance junction to sink
Characteristic Values
Symbol
Conditions
VGE [V]
VGS [V]
VCE [V]
VDS [V]
VF [V]
IC [A]
ID [A]
IF [A]
Tj [°C]
Min
Value
Typ
Max
Unit
VF
150
25
150
25
Irm
1200
150
RthJH
Thermal grease
thickness ≤ 50um
λ = 1 W/mK
I RRM
t rr
Qr
di /dt
di /dt
=
=
2520
2365
A/μs
A/μs
±15
E rec
(di rf/dt )max
600
151
25
150
25
150
25
150
25
150
25
150
2,50
2,7
V
2,53
180
µA
28000
0,54
77
107
125
492
8
24,3
2,1
8,2
990
1268
K/W
A
ns
μC
mWs
A/µs
25
VF
77
125
25
Ir
1600
150
R th(j-s)
Thermal grease
thickness ≤ 50 µm
λ = 1 W/mK
1,03
1,21
V
1,12
50
µA
1100
0,54
K/W
Copyright Vincotech
5
12 Apr. 2016 / Revision1