V23990-P704-F Datasheet, PDF (3/3 Pages) Vincotech – power flow through for simple PCB routing

V23990-P70X-A
flow90PACK1
V23990-P70X-F-U-01-14
Handling Instruction
Handling Instructions...
… to the PCB
x The module must be fixed to the PCB by clipping into the adequate holes before pin soldering. See
below
x After fixing all pins must be soldered into the PCB.
x During assembly, at a max. module temperature of 25°C, the pins should not be drawn or pushed
more than ±0.2 mm or loaded with a higher force than 35N.
x At a maximum substrate-temperature of 100°C the load of the pin should not exceed ±5N.
x Vibration stress on pins is not allowed
...to the heat sink
x the heat sink surface must be clean and particle less.
x the flatness must be < 0.05 mm for 100 mm continuous.
x the surface roughness should be less than
R_Z = 0.01 mm.
...to the thermal paste
x homogenous applying of the thermal conducting paste over the whole module plate with a
thickness of max. 0.05 mm.
x Thicker thermal paste can raise the value of the R_th.
...to the fastening screws to the heat sink if plain washer is used and optional with a spring lock
washer
Important parameter
screw
flat washer
spring washer
mounting torque
M4 DIN 7985
DIN 125 or DIN 433
DIN 127 or DIN 128
M_a =2.0-2.2Nm
Copyright by Vincotech
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Revision: 1