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V048F030T070 Datasheet, PDF (9/11 Pages) Vicor Corporation – VTM Current Multiplier
Application Note
Parallel Operation
In applications requiring higher current or redundancy, VTMs can be
operated in parallel without adding control circuitry or signal lines. To
maximize current sharing accuracy, it is imperative that the source and
load impedance on each VTM in a parallel array be equal. If VTMs are
being fed by an upstream PRM, the VC nodes of all VTMs must be
connected to the PRM VC.
To achieve matched impedances, dedicated power planes within the PC
board should be used for the output and output return paths to the
array of paralleled VTMs. This technique is preferable to using traces of
varying size and length.
The VTM power train and control architecture allow bi-directional
power transfer when the VTM is operating within its specified ranges.
Bi-directional power processing improves transient response in the
event of an output load dump. The VTM may operate in reverse,
returning output power back to the input source. It does so efficiently.
Input Impedance Recommendations
To take full advantage of the VTM’s capabilities, the impedance of the
source (input source plus the PC board impedance) must be low over a
range from DC to 5 MHz. The input of the VTM (factorized bus) should
be locally bypassed with a 8 µF low Q aluminum electrolytic capacitor.
Additional input capacitance may be added to improve transient
performance or compensate for high source impedance. The VTM has
extremely wide bandwidth so the source response to transients is
usually the limiting factor in overall output response of the VTM.
Anomalies in the response of the source will appear at the output of
the VTM, multiplied by its K factor of 1/16. The DC resistance of the
source should be kept as low as possible to minimize voltage deviations
on the input to the VTM. If the VTM is going to be operating close to
the high limit of its input range, make sure input voltage deviations will
not trigger the input overvoltage turn-off threshold.
Input Fuse Recommendations
V•I Chips are not internally fused in order to provide flexibility in
configuring power systems. However, input line fusing of V•I Chips
must always be incorporated within the power system. A fast acting
fuse is required to meet safety agency Conditions of Acceptability. The
input line fuse should be placed in series with the +In port.
Application Notes
For VTM and V•I Chip application notes on soldering, thermal
management, board layout, and system design click on the link below:
http://www.vicorpower.com/technical_library/application_information/chips/
Input reflected ripple
measurement point
F1
7A
Fuse
C1
47 µF
Al electrolytic
C2
0.47 μF
ceramic
14 V +–
+Out
+In
-Out
TM
VC
VTM
PC
+Out
K
Ro -In
-Out
R3
10 mΩ
C3
10 µF
+
Load
Notes:
– C3 should be placed close
to the load
R3 may be ESR of C3 or a
separate damping resistor.
Figure 15 — VTM test circuit
V•I Chip VTM Level 1 DC Behavioral Model for 48 V to 3 V, 70 A
IOUT
+
V•I
1/16 • Iout
1/16 • Vin
++
VIN
IQ
63 mA
––
K
–
ROUT
1.7 mΩ
+
VOUT
–
©
Figure 16 — This model characterizes the DC operation of the V•I Chip VTM, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048F030T070
Rev. 2.7
Page 9 of 11