B048F040T20 Datasheet, PDF (9/12 Pages) Vicor Corporation – BCM Bus Converter

Configuration Options
V•I Chip Bus Converter Module
NOTES:
1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF
COPPER. ALL PCB LAYERS.
2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555].
THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING.
AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN
HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.
(mm)
4. DIMENSION ARE inch .
ø2.95±0.07 (2) PL
[0.116±0.003]
N O N - P L AT E D
THROUGH HOLE
SEE NOTE 1.
(36.50)
1.437
(18.25)
0.719
(4.37)
0.172
(11.37)
0.448
(7.00)
0.276
(2.510)
0.099
(31.48)
1.240
HEAT SINK PUSH-PIN HOLE PATTERN
( TOP SIDE SHOWN )
SEE NOTE 3
(39.50)
1.555
SEE NOTE 2.
DOTTED LINE
INDICATES VIC
POSITION
SEE NOTE 3
Figure 19 — Hole location for push pin heat sink relative to V•I Chip
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 9 of 12