V048F040T050 Datasheet, PDF (6/13 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module

Configuration Options
PRELIMINARY
CONFIGURATION
Junction-Board
Thermal Resistance
Junction-Case
Thermal Resistance
Junction-Ambient
Thermal Resistance 300LFM
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
Standard⁽¹⁾
(Figure 15)
2.4 °C/W
1.1 °C/W
6.8 °C/W
V•I Chip Voltage Transformation Module
Standard with 0.25"
heatsink
2.4 °C/W
N/A
5.0 °C/W
22.0
0.87
32.0
1.26
6.3
0.25
STANDARD MOUNT
Figure 10—Onboard mounting – package F
Figure 11—Hole location for push pin heatsink relative to VIC
Thermal
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-board thermal impedance
Junction-to-ambient ⁽¹⁾
Junction-to-ambient ⁽²⁾
Min
125
Typ
Max
130
135
0.61
1.1
2.1
6.5
5.0
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes:
(1) V048F040T050 surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048F040T050 with a 0.25"H heatsink mounted on FR4 board, 300 LFM.
Note
Junction temperature
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048F040T050
Rev. 1.1
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