PI3542-00-LGIZ Datasheet, PDF (34/37 Pages) Vicor Corporation – 36 Vin to 60 Vin Cool-Power ZVS Buck Regulator & LED Driver

The recommended component placement, shown in
Figure 71, illustrates the tight path between C_IN and C_OUT
(and V_IN and V_OUT) for the high AC return current. This
optimized layout is used on the PI354x-00 evaluation board.
C_OUT
C_IN
V_OUT
GND
V_IN
GND
VSW
PI354x-00
Figure 72 details the recommended receiving footprint for
PI354x-00 10 mm x 10 mm package. All pads should have a
final copper size of 0.55 mm x 0.55 mm, whether they are
solder-mask defined or copper defined, on a 1 mm x 1 mm
grid. All stencil openings are 0.45 mm when using either
a 5 mil or 6 mil stencil.
Figure 71 — Recommended component placement and metal routing
Recommended PCB Footprint and Stencil
Outline of 10mm x 10
mm SIP package.
All pads are on 1mm square grid.
0.55mm
0.55mm
0.50mm
0.55mm (CDP)
A
1.00mm
0.65mm
0.65mm
0.55mm (CDP)
Detail A - Recommended soldermask openings.
CDP = Copper defined pads.
Pin A1
0.50mm
1.00mm
Figure 72 — Recommended Receiving PCB footprint
Cool-Power®
Page 34 of 37
Rev 1.3
2/2016
vicorpower.com
800 927.9474