BC384R120T060VM-00 Datasheet, PDF (3/6 Pages) Vicor Corporation – BCM Array™

SPECIFICATIONS (CONT.)
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Operating temperature - heatsink
Junction-to-heatsink thermal impedance (R_θJC)
Heatsink to ambient thermal impedance (R_θHA)
Min
4242
5
125
Typ
Max
1.8
1000
cTÜVus
CE Mark
3.2/92
3.54/ 89,9
0.56/ 14,2
1.13/ 28,7
130
0.50
5.95
3.55/ 90,1
0.57/ 14,6
1.18/ 30,0
135
100
0.65
6.10
Unit
Mhrs
Vdc
pF
MΩ
oz /g
in / mm
in / mm
in / mm
°C
°C
°C/ W
°C/ W
Note
25°C, GB
Input to Output
Input to Output
Input to Output
Safty agency approvals pending
Low Voltage Directive
See Mechanical Drawings
Junction temperature
See thermal curve, Figure 1
Heatsink temperature measured
in location shown in Figure 2
http://www.vicorpower.com/
technical_library/calculators/calc_t~1.xls
Auxiliary Pins (Conditions are at 384 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Enable / Disable (CNTRL)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
Min
Typ
Max
Unit
4.8
5.0
5.2
Vdc
2.4
2.5
Vdc
2.5
2.6
Vdc
4.8
5.0
5.8
mA
240
ms
40
µs
Note
Source only
Time from PC low to output low
VI BRICK BCM Array
BC384R120T060VM-00
vicorpower.com
Rev. 1.1
Page 3 of 6