V048X060Y040A Datasheet, PDF (17/18 Pages) Vicor Corporation – High Efficiency, Sine Amplitude Converter

Not Recommended for New Designs
17.5 RECOMMENDED HEAT SINK PUSH PIN LOCATION
V048x060y040A
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Notes:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) Minimum recommended pitch is 39.50 (1.555).
This provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
17.6 VTM MODULE PIN CONFIGURATION
3. VI Chip^® module land pattern shown for reference
only; actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full-size VI Chip^® products.
4. RoHS compliant per CST–0001 latest revision.
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = ±0.3 (0.01)
x.xx (x.xxx) = ±0.13 (0.005)
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
+Out
-Out
+Out
-Out
43
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
21
A
B
C
D
E
H
J
K
L
M
N
P
R
T
+In
TM
VC
PC
-In
Bottom View
Signal Name
+In
–In
TM
VC
PC
+Out
–Out
Pin Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4, J3-M3, J4-M4
E3-H3, E4-H4, N3-T3, N4-T4
VTM^® Current Multiplier
Page 17 of 18
Rev 1.0
01/2014
vicorpower.com
800 927.9474