B048K120T20 Datasheet, PDF (11/16 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Configuration Options (Cont.)
22.0
0.87
32.0
1.26
9.5
0.37
mm
in
Figure 21— On-board elevated mounting – package A
F1
7A
Fuse
R1
0.30 Ω
C1
10 µF
ceramic
Input reflected ripple
measurement point
C2
0.47 µF
ceramic
Enable/Disable Switch
R2
2K Ω
SW1 ^D1
+Out
+In
-Out
TM
RSV
BCM
PC
+Out
K
Ro -In
-Out
Figure 22—BCM test circuit
Notes:
+
Temperature Monitor
–
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance is required.
C3 should be placed close to the load.
D1 power good indicator will dim when a module fault is detected.
TM should always be referenced to SG.
+
R3
0.1 Ω
C3
1 µF
ceramic
Load
–
45 Vicor Corporation
Tel: [phone]
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 11 of 16