B048K480T30 Datasheet, PDF (10/15 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Configuration Options
PRELIMINARY
V•I Chip Bus Converter Module
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Inboard⁽¹⁾
(Package K)
1750 W/in³
2.1 °C/W
1.1 °C/W
6.5 °C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
Onboard⁽¹⁾
(Package F)
1090 W/in³
2.4 °C/W
1.1 °C/W
6.8 °C/W
Inboard with 0.25"
Heatsink
680 W/in³
2.1 °C/W
N/A
Onboard with 0.25"
Heatsink
550 W/in³
2.4 °C/W
N/A
5.0 °C/W
5.0 °C/W
21.5
0.85
22.0
0.87
32.0
32.0
1.26
1.26
4.0
6.3
0.16
0.25
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 19—Inboard mounting – package K
Figure 20— Onboard mounting – package F
F1
10 A
Fuse
C1
47 µF
electrolytic
Input reflected ripple
measurement point
Enable/Disable Switch
R2
2 kΩ
SW1 ^D1
+Out
+In
-Out
TM
RSV
BCM
PC
+Out
K
Ro -In
-Out
+
R3
5 mΩ
Load
C3
9.4 µF
–
Figure 21—BCM test circuit
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 10 of 15