16808 Datasheet, PDF (1/1 Pages) Vicor Corporation – PCB LAYOUT DRAWING FOR MINI SIZE MODULE

0.027
0.027
0.050
TYP
0.265
0.328
0.467
0.050
TYP
38°
0.254
0.131
0.230
0.115
0.102
0.138
0.313
0.027
Ø 0.032 ± 0.003
16 VIA HOLES
0.027
0.065
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
7 x Ø 0.233
FREE OF SOLDER MASK
Ø 0.016 NON PLATED THRU
7 PL
0.266
0.340
0.027
0.069
Ø 0.032 ± 0.003
3 VIA HOLES
SEE DETAIL A
0.063
1,59
DETAIL A
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
55°
0.604
0.277
0.027
0.050
TYP
0.226
0.034
Ø 0.032 ± 0.003
29 VIA HOLES
0.230
TYP
Ø 0.032 ± 0.003
3 VIA HOLES
0.115
0.065
0.152
0.027
0.065
0.202
0.350
0.340
0.069
0.266
7 x Ø 0.016
1.900
48,26
1.600
40,64
0.063
1,59
0.300
7,62
2 x 0.125 ± 0.002
3,18 ± 0,05
SEE DETAIL B
0.027
0.050
TYP
0.034
0.159
0.318
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
2 x Ø 0.316
FREE OF SOLDER MASK
PCB Layout Drawing
for Mini Size Module
2.096
53,24
PCB
0.250
6,36
0.56
MAX
PIN LEGEND
Mini
FARM
Pin
Number
1
2
3
4
5
6
7
8
9
Symbol
+
PC
PR
–
–
–S
SC
+S
+
Function Symbol
+IN
N
Prim. Control EMI GRD
Parallel
NC
–IN
L
–OUT
–
– Sense
EN
Sec. Control ST
+Sense
BOK
+Out
+
Function
Neutral
EMI
Line
– Out
Enable
Strap
BUS OK
+ OUT
Pin Dia.
(Inches / mm)
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
SURFMATE INPUT
CONNECTOR
2.000
50,8
0.300
7,62
43
21
5 67 8 9
0.400
10,16
0.700
17,78
1.000
25,4
1.400
35,56
1.900 ± 0.002
48,26 ± 0,05
0.536
13,61
6 x ø0.064 ± 0.003
1,63 ±0,08
(#52 DRILL)
4 x ø 0.130 ± 0.003
3,30 ± 0,08
PLATED THRU HOLE
FOR STANDOFF MTG
0.097
2,47
0.536
13,61
0.251
6,36
0.250
6,35
MODULE
MODULE
EXCHANGE
TOOL-
BOTH ENDS
(PARTIAL)
3
1 0.15
2
3,8
0.80 ± 0.03
20,3 ± 0,8
0.440
11,18
PCB
0.06
1,6
43
21
1.98
50,3
5 678 9
0.265
6,73
2.430
61,72
0.491
12,47
MODULE
EXCHANGE
TOOL
0.38
9,5
15°
1.25
31,6
0.80
20,3
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
MODULE
BASEPLATE
PCB
SURFMATE OUTPUT
CONNECTOR
DETAIL B
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
0.006
0,15 ^REF
BOTTOM OF
CAP TO TOP
OF PCB
DETAIL C
PRODUCT APPLICATION SPECIFICATIONS