VS-705 Datasheet, PDF (6/9 Pages) Vectron International, Inc – Single Frequency VCSO

VS-705 Single Frequency VCSO
Reliability
VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and
IR reflow simulation. The VS-705 family is capable of meeting the following qualification tests:
Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solvents
Moisture Sensitivity Level
Conditions
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2016
IPC/JEDEC J-STD-020, MSL1
Handling Precautions
Although ESD protection circuitry has been designed into the VS-705 proper precautions should be taken when
handling and mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD
susceptibility testing and design protection evaluation.
ESD Ratings
Model
Human Body Model
Charged Device Model
Machine Model
Minimum
2000 V
1000 V
200 V
Conditions
MIL-STD 883, Method 3015
JEDEC, JESD22-C101
JEDEC, JESD22-A115-A
Reflow Profile (IPC/JEDEC J-STD-020)
Parameter
Symbol
PreHeat Time
t_S
Ramp Up
R _UP
Time Above 217 ^oC
t_L
Time To Peak Temperature
Time At 260 ^oC
Ramp Down
t _AMB-P
t_P
R _DN
The device has been qualified to meet the JEDEC
standard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-Free
small body requirements. The temperatures refer to
the topside of the package, measured on the package
body surface. The VS-705 device is hermetically
sealed so an aqueous wash is not an issue.
Terminal Plating: Electroless Ni > 1.90 μm
Electroless Au > 1.50 μm
Value
60 sec Min, 180 sec Max
3 ^oC/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 ^oC/sec Max
260
R _UP
217
200
150
t_S
t_L
t_P
R _DN
t _AMB-P
25
Time (sec)
Vectron International, 267 Lowell Road, Hudson, NH 03051
Page 6 of 9
Tel: 1-88-VECTRON-1 • Web: www.vectron.com
Rev: 23Oct2008