LV2622 Datasheet, PDF (6/8 Pages) Unisonic Technologies – 250μA, 3MHZ, LOW VOLTAGE RAIL-TO-RAIL I/O CMOS DUAL OP AMPS

LV2622
Preliminary
LINEAR INTEGRATED CIRCUIT
„ APPLICATION NOTES(Cont.)
Power-Supply Bypassing and Layout
The UTC LV2622 can apply for a single +2.5V~+5.5V supply or dual ±1.25V~±2.75V supplies. For single-supply
operation, a 0.1µF ceramic capacitor should be placed close to the V_DD pin to bypass the power supply V_DD. For
dual-supply operation, separate 0.1µF ceramic capacitors should be placed to the V_DD and the V_SS supplies to
bypass them to ground, and 2.2µF tantalum capacitor for better performance.
By decreasing the amount of stray capacitance at the op amp’s inputs and output, PC board l performance can be
optimized. For example, placing external components as close to the device as possible can minimize trace lengths
and widths. and using surface-mount components is a better way.
For the operational amplifier, soldering the part to the board directly is strongly recommended. The EMI can be
minimized because keeping the high frequency big current loop area small.
Grounding
A ground plane layer is important for UTC LV2622 circuit design. The length of the current path speed currents in
an inductive ground return will create an unwanted voltage noise. Broad ground plane areas will reduce the parasitic
inductance.
Input-to-Output Coupling
The input and output signal traces should not be parallel to minimize capacitive coupling. This helps reducing
unwanted positive feedback.
UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
6 of 8
QW-R102-045.a