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UR5515 Datasheet, PDF (5/8 Pages) Unisonic Technologies – 1.5A/3A BUS TERMINATION REGULATOR
UR5515
TYPICAL APPLICATION CIRCUIT
CMOS IC

R1= R2= 100KΩ
COUT(min)=10µF(Ceramic) + 1000µF under the worst case testing condition
CSS=1µF, CIN = 40µF(low ESR), CCNTL= 47µF
APPLICATIONS INFORMATION
Please note the point of thermal shutdown will be degraded by around 20Â¥while VCNTL equal to 5V compared
with 3.3V. It is highly recommended that to use the 3.3V rail acted as the VCNTL in SOP-8 package. Nevertheless,
this small footprint of PCB for plastic SOP-8 package is not enough to dissipate effectively the heat generated
when operating at high current levels. In order to control die operating temperatures, the PCB layout should allow
for maximum possible copper area at the four VCNTL pins. Besides, an appropriate power plane heat sink must be
used to prevent overstepping maximum junction temperature. The recommended SMT is as below.
Use vias to conduct the heat into the
buried or backside of PCB layer.
The PCB heat sink copper area should be
solder painted without masked. This
approaches a "best case " pad heat sink .
UTC UR5515 (SOP-8)


UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
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QW-R502-056,A