MCM2012B Datasheet, PDF (7/8 Pages) UN Semiconducctor INC – (Chip Common Mode Filter) Engineering Specification

(Chip Common Mode Filter) Engineering Specification
MCM2012B Series
REEL DIMENSIONS
STANDARD QUANTITY FOR PACKAGING
Packaging style : Taping
Reel packaging quantity : 3000 pcs/reel
Inner box : 5 reel/inner box
RECOMMENDED SOLDERING CONDITIONS
GENERAL TECHNICAL DATA
Opertation temperatur range : -40℃ ~ +85℃
Storage Condition : Less than 40℃ and 70% RH
Storage Time: 6 months Max.
Soldering method: Reflow or Wave Soldering
UN Semiconductor Co., Ltd.
Revision December 18, 2014
7/8
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.