 English |
|
|
|
|
|
|
|
| TCF03025FH35002A Datasheet, PDF (5/5 Pages) UN Semiconducctor INC – Engineering Specification | |||
| |||
| ◁ |
Engineering Specification
TCF03025FH35002A
RECOMMENDED REFLOW SOLDERING
The normal to
A 1st rising temperature
Preheating temperature
B Preheating
140â to 160â
C 2nd rising temperaturePreheating to 200â
if 220â
if 230â
D Main heating
if 240â
if 250â
if 260â
E Regular cooling
z According to J-STD-020C
200â to 100â
30s to 60s
60s to 120s
20s to 40s
50sï½60s
40sï½50s
30sï½40s
20sï½40s
20sï½40s
1â/s ï½ 4â/s
UN Semiconductor Co., Ltd.
Revision December 18, 2014
5/5
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
|
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese