K0900S Datasheet, PDF (3/5 Pages) UN Semiconducctor INC – Sidac

Sidac
TP
TL
TS(max)
Ramp-up
TS(min)
25
Preheat
Time to peak temperature
(t 25℃ to peak)
Critical Zone
TL to TP
Ramp-down
Time
Reflow Condition
Lead–free assembly
Pre Heat
-Temperature Min (Ts(min))
-Temperature Max (Ts(max))
+150°C
+200°C
-Time (min to max) (ts)
60 -180 Seconds
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/Second Max
TS(max) to TL - Ramp-up Rate
3°C/Second Max
Reflow
- Temperature (TL) (Liquidus) +217°C
- Time (min to max) (ts)
60 -150 Seconds
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of actual peak Temperature
(tp)
8-15 Seconds
Ramp-down Rate
6°C/Second Max
Time 25°C to peak Temperature (TP)
Do not exceed
8 minutes Max
+260°C
Part Number
SOD-123FL
DO214AC/SMA
DO214AA/SMB
REEL DIAMETERS (mm) REEL(PCS)
178
3000
330
5000
330
3000
PER CARTON (PCS)
96000
80000
48000
Revision December 18, 2013
3/5
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.