K0900G Datasheet, PDF (3/3 Pages) UN Semiconducctor INC – Sidac

Sidac
TP
TL
TS(max)
Ramp-up
TS(min)
25
Preheat
Time to peak temperature
(t 25℃ to peak)
Critical Zone
TL to TP
Ramp-down
Time
Reflow Condition
Lead–free assembly
Pre Heat
-Temperature Min (Ts(min))
-Temperature Max (Ts(max))
+150°C
+200°C
-Time (min to max) (ts)
60 -180 Seconds
Average ramp up rate ( Liquidus Temp TL) _{3°C/Second Max}
to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Time (min to max) (ts)
3°C/Second Max
+217°C
60 -150 Seconds
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of actual peak Temperature
(tp)
8-15 Seconds
Ramp-down Rate
6°C/Second Max
Time 25°C to peak Temperature (TP)
Do not exceed
8 minutes Max
+260°C
Dimensions
B
D
G
L
Inches
Min
Max
0.028
0.120
0.235
1.000
0.034
0.140
0.270
Millimeters
Min
Max
0.711
3.048
5.969
25.40
0.864
3.556
6.858
Part Number
KxxxxG
Case Type
DO-15/DO-204AC
Quantity
2000
Packing Option
Box
Revision December 18, 2013
3/3
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.