JK600 Datasheet, PDF (3/4 Pages) UN Semiconducctor INC – Radial Lead Resettable Polymer PTCs

Radial Lead Resettable Polymer PTCs
JK600 Series
Test Procedures and Requirement
Test
Test Conditions
Resistance
Hold Current
Time to Trip
Frequency Current withstand
Failure mode
In still air @25±2°C
60 min, at Ihold, In still air @25±2°C
Specified current, Vmax, @25±2°C
380V / Imax, 20 cycle
V maxi / 5A, 60 minute
Soldering Parameters
Accept/Reject Criteria
Rmin≤R≤Rmax
No trip
T≤Maximum Time To Trip
Resistance of the variation of the poor value:≤30%
No buming
Pre-Heating Zone
Refer to the condition recommended
by the manufacturer. Max. ramping
rate should not exceed 4°C/Sec
Soldering Zone
Cooling Zone
Max. solder temperature should not
exceed 260°C
Cooling by natural convection in air
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
Tin-plated Copper
Solder ability per MIL-STD-202, Method 208E
Cured, flame retardant epoxy polymer meets UL 94V-0
requirements.
Marked with ‘SC’, voltage, current rating
Part Numbering
Part Marking
UN Semiconductor Co., Ltd.
Revision October 18, 2013
3/4
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.