JK30 Datasheet, PDF (3/4 Pages) UN Semiconducctor INC – Radial Lead Resettable Polymer PTCs

Radial Lead Resettable Polymer PTCs
JK30 Series
Test Procedures and Requirement
Test
Resistance
Hold Current
Time to Trip
Trip Cycle Life
Trip Endurance
Test Conditions
In still air @25±2°C
60 min, at Ihold, In still air @25±2°C
Specified current, Vmax, @25±2°C
Vmax, Imax,100 cycles
Vmax,24hours
Soldering Parameters
Accept/Reject Criteria
Rmin≤R≤Rmax
No trip
T≤Maximum Time To Trip
No arcing or burning
No arcing or burning
Pre-Heating Zone
Refer to the condition recommended
by the manufacturer. Max. ramping
rate should not exceed 4°C/Sec
Soldering Zone
Max. solder temperature should not
exceed 260°C
Cooling Zone Cooling by natural convection in air
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
0.75-1.85A Tin-plated Copper clad steel
2.5-9.0A Tin-plated Copper
Solder ability per MIL-STD-202, Method 208E
Cured, flame retardant epoxy polymer meets UL 94V-0
requirements.
Marked with ‘UN’, voltage, current rating
Part Numbering
Part Marking
UN Semiconductor Co., Ltd.
Revision October 18, 2013
3/4
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.