JK250 Datasheet, PDF (3/4 Pages) UN Semiconducctor INC – Radial Lead Resettable Polymer PTCs

Radial Lead Resettable Polymer PTCs
JK250 Series
Test
Resistance
Hold Current
Time to Trip
Trip Cycle Life
Trip Endurance
Test Conditions
In still air @25±2°C
60 min, at Ihold, In still air @25±2°C
Specified current, Vmax, @25±2°C
Vmax, Imax,100 cycles
Vmax,24hours
Soldering Parameters
Accept/Reject Criteria
Rmin≤R≤Rmax
No trip
T≤Maximum Time To Trip
No arcing or burning
No arcing or burning
Refer to the condition recommended
Pre-Heating Zone by the manufacturer. Max. ramping
rate should not exceed 4°C/Sec
Soldering Zone
Max. solder temperature should not
exceed 260°C
Cooling Zone Cooling by natural convection in air
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
0.02-0.04A Tin-plated Copper clad steel
0.05-2.00A Tin-plated Copper
Solder ability per MIL-STD-202, Method 208E
Cured, flame retardant epoxy polymer meets UL 94V-0
requirements.
Marked with ‘SC’, voltage, current rating
Dimensions
Figure1
Part Number Figure
JK250-020U
JK250-030U
JK250-040U
JK250-060U
Figure1(2)
Figure1(2)
Figure1(2)
Figure1(2)
A
mm
Max.
7.4
7.4
7.4
7.4
UN Semiconductor Co., Ltd.
Revision October 18, 2013
Figure2
B
mm
Max.
12.7
12.7
12.7
12.7
Figure3
C
D
mm
mm
Typ.
Max.
5.1
3.8
5.1
3.8
5.1
3.8
5.1
3.8
Figure4
Lead (dia)
Inches mm
Packaging
(Bulk Pack)
0.020 0.5
0.020 0.5
0.020 0.5
0.024 0.6
1000
1000
1000
1000
3/4
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.