MCM1012B Datasheet, PDF (1/6 Pages) UN Semiconducctor INC – LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification

LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
MCM1012B Series
Features and Application
Powerful components with composite co-fired material to
solve EMI problem for high speed differential signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
MIPI, MHL serial interface in mobile device.
PRODUCT DETAIL
Part Number
MCM1012B360F06BP
Imp.Com.
(Ω)±25%
@100MHz
36
DCR
Max.
(Ω)
0.50
Rated
Current
Max.(m A)
300
Rated
Voltage
(V)
10
MCM1012B670F06BP
67
0.50
300
10
MCM1012B900F06BP
90
0.60
300
10
Test Instruments
◆ Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
◆ HP4338 MILLIOHMMETER
◆ Agilent E5071C ENA SERIES NETWORK ANALYZER
◆ Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
Withstand
Voltage
(V)
25
25
25
Insulation
Resistance
Min.(MΩ)
200
200
200
MCM 1012 B 90 0 F 06 B P
1
2 3 4 56 7 89
1: Series name
2: Dimensions L*W
3: Material code
4: Impedance(Ω) ±25%
5: Fixed Decimal Point
6: Rated Current Code
A=50mA B=80mA
(ex：900=90Ω)
C=100mA D=150mA E=200mA F=300mA
G=400mA H=500mA I=600mA J=700mA K=800mA
7: Dimension T (ex : 06=0.60mm)
8:Soldering:Green Parts:A-Soldering Lead-FREE B-Lead-Free for whole chip
9: Packaging style P – Embossed paper tape, 7”reel.
UN Semiconductor Co., Ltd.
Revision December 18, 2014
1/6
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.