UM5055 Datasheet, PDF (3/5 Pages) Union Semiconductor, Inc. – Single Line ESD Protection Diode Array

UM5055
Electrical Characteristics
(T=25°C, Device for 5.0V Reverse Stand-off Voltage)
Parameter
Symbol
Conditions
Min Typ Max Unit
Reverse Stand-Off
Voltage
V_RWM
5
V
Reverse Breakdown
Voltage
Reverse Leakage
Current
V_BR
It = 1mA
6 6.8 7.8
V
I_R
V_RWM = 5V, T=25°C
0.1
μA
Clamping Voltage
V_C
I_PP = 5A, t_p = 8/20μS
I_PP =11A, t_p = 8/20μS
9.1
V
13
Forward Voltage
V_F
Junction Capacitance
C_J
I_F = 10mA
V_R = 0V, f = 1MHz
0.8
V
40
55
pF
Junction Capacitance
C_J
V_R = 2.5V, f = 1MHz
30
40
pF
Applications Information
Device Connection Options
UM5055 ESD protection diode is designed to protect one data, I/O, or power supply line. The
device is unidirectional and may be used on lines where the signal polarity is above ground. The
cathode band should be placed towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground
vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte
tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads
is small compared to the solder paste volume that is placed on the land pattern of the PCB, the
reflow profile will be determined by the requirements of the solder paste. Therefore, these devices
are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other
lead-free compositions, matte tin does not have any added alloys that can cause degradation of the
solder joint.
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http://www.union-ic.com Rev.03 Jul. 2013
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