UM5052DA Datasheet, PDF (3/5 Pages) Union Semiconductor, Inc. – Single Line Bi-directional ESD Protection Diode Array

UM5052DA
Electrical Characteristics
(T=25°C, Device for 5.0V Reverse Stand-off Voltage)
PARAMETER SYMBOL CONDITIONS
Reverse Stand-Off
Voltage
V_RWM
Reverse Breakdown
Voltage
Reverse Leakage
Current
V_BR
It = 1mA
I_R
V_RWM = 5V, T=25°C
Clamping Voltage
V_C
I_PP = 5A, t_p = 8/20μS
Junction Capacitance
Junction Capacitance
C_J
V_R = 0V, f = 1MHz
C_J
V_R = 2.5V, f = 1MHz
MIN TYP MAX
5
6.5 8.0 8.5
1
12
7 10
6
9
UNIT
V
V
μA
V
pF
pF
Applications Information
Device Connection Options
UM5052DA ESD protection diode is designed to protect one bidirectional data, I/O, or power
supply line from the damage caused by ESD and surge pluses. The device is bidirectional and can
be used on lines where the signal polarity is above ground and below ground.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1) Place the TVS near the input terminals or connectors to restrict transient coupling.
2) Minimize the path length between the TVS and the protected line.
3) Minimize all conductive loops including power and ground loops.
4) The ESD transient return path to ground should be kept as short as possible.
5) Never run critical signals near board edges.
6) Use ground planes whenever possible. For multilayer printed-circuit boards, use ground
vias.
7) Keep parallel signal paths to a minimum.
8) Avoid running protection conductors in parallel with unprotected conductor.
9) Minimize all printed-circuit board conductive loops including power and ground loops.
10) Avoid using shared transient return paths to a common ground point.
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http://www.union-ic.com Rev.01 Dec.2012
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