CHU2277A98F_15 Datasheet, PDF (9/12 Pages) United Monolithic Semiconductors – W-band Multifunction: Multiplier / MPA

W-band Multiplier/MPA
Recommended assembly plan
CHU2277a98F
25µm wedge bonding is preferred
Note: Supply feed should be bypassed. 25µm diameter gold wire is to be preferred.
This drawing shows an example of assembly and bias configuration. All the
transistors are internally self-biased. An external capacitor is recommended for
the positive and negative supply voltages.
For the RF pads the equivalent wire bonding inductance (diameter=25µm) have
to be according to the following recommendation.
Recommended circuit bonding table
Port
Equivalent inductance (nH)
Wire length (mm) ⁽¹⁾
IN (2)
L_in=0.32
0.4
OUT1 (5)
L_out1=0.32
0.4
OUT2 (8)
L_out2=0.32
0.4
(1) _{This value is the total length including the necessary loop from pad to pad.}
For a micro-strip configuration a hole in the substrate is necessary for chip assembly
Ref. : DSCHU2277a0266 - 23 Sept 10
9/12
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Specifications subject to change without notice