CHR2411-QDG Datasheet, PDF (7/8 Pages) United Monolithic Semiconductors – 22-24.5GHz RX Multifunction

K-band RX
CHR2411-QDG
ESD sensitivity
Norm
MIL-STD-1686C
ESD STM5.1-1998
Value
HBM Class 1 (<1000V)
HBM Class 0 (<250V)
Package Information
Parameter
Package body material
Lead finish
MSL Rating
RoHS-compliant Low stress Injection Molded Plastic
100% matte Sn
MSL1
Recommended surface mount package assembly
(see UMS AN0017)
For volume production the SMD type package can be treated as a standard surface mount component (please refer to the
IPC/JEDEC J-STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard
assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution
should be taken to perform a good and reliable contact over the whole pad area.
300
280
255
260
240
217
220
200
180
160 150
140
120
100
80
60
40
20
0
0
20
MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS
Maximum Ramp up rate : 3°C / second
30s Max
40
60
80
100 120 140 160 180 200 220 240 260 280 300 320 340 360
Time (s)
Attention:
The solder thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the package and the
motherboard should be within 50µm [2 mils].
It is important for the performance of the product that the whole overlapping area between the motherboard and package pads
is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will
lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and
lifetime of the product.
Ref. : DSCHR2411QDG6174 - 23 Jun 06
7/8
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: [phone] - Fax : [phone]
Specifications subject to change without notice