CHM1290 Datasheet, PDF (5/6 Pages) United Monolithic Semiconductors – 20-30GHz SUB-HARMONICALLY PUMPED MIXER

20-30GHz SHP Mixer
Chip Assembly and Mechanical Data
CHM1290
Vd Voltage
RF
Input/Output bonding wires as
short as possible
10nF
120pF
IF
Input/Output DC coupled to
diodes
LO
Input/Output bonding wires as
short as possible
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
810 +/- 35
35
1280 +/- 35
860
760
260
140
35
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHM12902045 - 14-Feb.-02
5/6
Specifications subject to change without notice
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