CHM1483-QFG_15 Datasheet, PDF (4/10 Pages) United Monolithic Semiconductors – 12-16GHz Direct Quadrature Modulator

CHM1483-QFG 12-16GHz Direct Quadrature Modulator
Device thermal performances
All the figures given in this section are obtained assuming that the QFN device is cooled
down only by conduction through the package thermal pad (no convection mode considered).
The temperature is monitored at the package back-side interface (Tcase) as shown below.
The system maximum temperature must be adjusted in order to guarantee that Tcase
remains below the maximum value specified in the next table. So, the system PCB must be
designed to comply with this requirement.
A derating must be applied on the dissipated power if the Tcase temperature cannot be
maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to
guarantee the nominal device life time (MTTF).
Ref. : DSCHM1483-QFG2305 - 31 Oct 12
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Specifications subject to change without notice