CHA5042 Datasheet, PDF (4/6 Pages) United Monolithic Semiconductors – 13-16GHz High Power Amplifier

CHA5042
13-16GHz High Power Amplifier
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
1.33
±0.35
23
1
8
(0, 0)
4
5
6
7
1.37 ±0.35
Bond Pad
Symbol
1
RF input
2
Vd1
3
Vd2
4
Vd3
5
RF output
6
Vg3
7
Vg2
8
Vg1
x-dim.
(um)
100
100
100
100
100
100
100
100
y-dim.
(um)
200
100
90
100
200
100
100
100
x-center
(um)
100
285
450
1120
1285
1280
895
505
y-center
(um)
820
1230
1230
1235
790
155
105
105
Chip size : 1370µm +/-35µm x 1330µm +/- 35µm
Ref. : DSCHA50422218 -06-Aug.-02
4/6
Specifications subject to change without notice
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