CHA4042 Datasheet, PDF (4/6 Pages) United Monolithic Semiconductors – 23-34GHz High Power Amplifier

CHA4042
23-34GHz High Power Amplifier
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
14
13 12 11 10
1.090
.338
15
123
.000
45
6
9
.467
8
.240
7
Bond Pad #1, 7, 9: GND
Bond Pad #4, 5, 11: GND
Bond Pad #14: GND
Bond Pad #2: VG1
Bond Pad #3: VG2
Bond Pad #6: VG3
Bond Pad #8: RF OUT
Bond Pad #10: VD3
Bond Pad #12: VD2
Bond Pad #13: VD1
Bond Pad #15: RF IN
(0.080 x 0.080)
(0.080 x 0.090)
(0.122 x 0.080)
(0.100 x 0.150)
(0.100 x 0.150)
(0.100 x 0.100)
(0.100 x 0.260)
(0.100 x 0.100)
(0.100 x 0.100)
(0.100 x 0.100)
(0.100 x 0.200)
Units: millimeters
Thickness: 0.070
Chip size : 1930µm +/-35µm x 1090µm +/- 35µm
Ref. : DSCHA40422218 -06-Aug.-02
4/6
Specifications subject to change without notice
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